Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing

B.W.H. Toh, N.D. McCusker, David McNeill, Harold Gamble, V.S.C. Len

Research output: Contribution to journalArticle

4 Citations (Scopus)
Original languageEnglish
Pages (from-to)307-312
Number of pages6
JournalJournal of Materials Science: Materials in Electronics
Issue number4-6
Publication statusPublished - Jun 2001

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