Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing

B.W.H. Toh, N.D. McCusker, David McNeill, Harold Gamble, V.S.C. Len

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	307-312
Number of pages	6
Journal	Journal of Materials Science: Materials in Electronics
Volume	12(4-6)
Issue number	4-6
Publication status	Published - Jun 2001

ASJC Scopus subject areas

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title = "Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing",

author = "B.W.H. Toh and N.D. McCusker and David McNeill and Harold Gamble and V.S.C. Len",

year = "2001",

month = jun,

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AU - McCusker, N.D.

AU - McNeill, David

AU - Gamble, Harold

AU - Len, V.S.C.

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