Surface morphology and residual stress of electroplated and electroless copper deposits

K.G. Keong; Wei Sha; Z.X. Guo; Savko Malinov

Surface morphology and residual stress of electroplated and electroless copper deposits

K.G. Keong
, Wei Sha
, Z.X. Guo
, Savko Malinov

Research output: Contribution to conference › Paper

Original language	English
Pages	285-299
Number of pages	15
Publication status	Published - Jun 2001
Event	5th International Conference on Computer Methods and Experimental Measurements for Surface Treatment Effects - Seville, Spain Duration: 01 Jun 2001 → 01 Jun 2001

Conference

Conference	5th International Conference on Computer Methods and Experimental Measurements for Surface Treatment Effects
Country/Territory	Spain
City	Seville
Period	01/06/2001 → 01/06/2001

Cite this

@conference{dc553cd924de4d5f8b32739c30e47484,

title = "Surface morphology and residual stress of electroplated and electroless copper deposits",

author = "K.G. Keong and Wei Sha and Z.X. Guo and Savko Malinov",

year = "2001",

month = jun,

language = "English",

pages = "285--299",

note = "5th International Conference on Computer Methods and Experimental Measurements for Surface Treatment Effects ; Conference date: 01-06-2001 Through 01-06-2001",

}

TY - CONF

T1 - Surface morphology and residual stress of electroplated and electroless copper deposits

AU - Keong, K.G.

AU - Sha, Wei

AU - Guo, Z.X.

AU - Malinov, Savko

PY - 2001/6

Y1 - 2001/6

M3 - Paper

SP - 285

EP - 299

T2 - 5th International Conference on Computer Methods and Experimental Measurements for Surface Treatment Effects

Y2 - 1 June 2001 through 1 June 2001

ER -