Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits

K.G. Keong, Wei Sha, Z.X. Guo, Savko Malinov

Research output: Contribution to conferencePaper

Original languageEnglish
Pages88-88
Number of pages1
Publication statusPublished - Aug 2001
EventInternational Conference on Surface and Interface Science and Engineering SISE’2001 - Shenzhen, China
Duration: 01 Aug 200101 Aug 2001

Conference

ConferenceInternational Conference on Surface and Interface Science and Engineering SISE’2001
CountryChina
CityShenzhen
Period01/08/200101/08/2001

Cite this