Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits

K.G. Keong; Wei Sha; Z.X. Guo; Savko Malinov

Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits

K.G. Keong
, Wei Sha
, Z.X. Guo
, Savko Malinov

Research output: Contribution to conference › Paper

Original language	English
Pages	88-88
Number of pages	1
Publication status	Published - Aug 2001
Event	International Conference on Surface and Interface Science and Engineering SISE’2001 - Shenzhen, China Duration: 01 Aug 2001 → 01 Aug 2001

Conference

Conference	International Conference on Surface and Interface Science and Engineering SISE’2001
Country/Territory	China
City	Shenzhen
Period	01/08/2001 → 01/08/2001

Cite this

@conference{aa25bfc5619b491fb9cecc91b7471a8f,

title = "Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits",

author = "K.G. Keong and Wei Sha and Z.X. Guo and Savko Malinov",

year = "2001",

month = aug,

language = "English",

pages = "88--88",

note = "International Conference on Surface and Interface Science and Engineering SISE{\textquoteright}2001 ; Conference date: 01-08-2001 Through 01-08-2001",

}

TY - CONF

T1 - Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits

AU - Keong, K.G.

AU - Sha, Wei

AU - Guo, Z.X.

AU - Malinov, Savko

PY - 2001/8

Y1 - 2001/8

M3 - Paper

SP - 88

EP - 88

T2 - International Conference on Surface and Interface Science and Engineering SISE’2001

Y2 - 1 August 2001 through 1 August 2001

ER -