Surface morphology of electroless copper deposits using different reducing agents

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	292-296
Number of pages	5
Journal	Synthesis and Reactivity in Inorganic, Metal-Organic, and Nano-Metal Chemistry
Volume	38
Issue number	3 PART 2
Publication status	Published - Apr 2008

ASJC Scopus subject areas

@article{aad43037a412450a89c26db910a4b269,

title = "Surface morphology of electroless copper deposits using different reducing agents",

author = "X. Wu and Wei Sha",

year = "2008",

month = apr,

language = "English",

volume = "38",

pages = "292--296",

journal = "Synthesis and Reactivity in Inorganic, Metal-Organic and Nano-Metal Chemistry",

issn = "1553-3174",

publisher = "Taylor and Francis Ltd.",

number = "3 PART 2",

}

TY - JOUR

T1 - Surface morphology of electroless copper deposits using different reducing agents

AU - Wu, X.

AU - Sha, Wei

PY - 2008/4

Y1 - 2008/4

UR - http://www.scopus.com/inward/record.url?scp=48249140631&partnerID=8YFLogxK

M3 - Article

VL - 38

SP - 292

EP - 296

JO - Synthesis and Reactivity in Inorganic, Metal-Organic and Nano-Metal Chemistry

JF - Synthesis and Reactivity in Inorganic, Metal-Organic and Nano-Metal Chemistry

SN - 1553-3174

IS - 3 PART 2

ER -