The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding

Research output: Contribution to conference › Paper

Original language	English
Pages	0-0
Number of pages	1
Publication status	Published - Dec 2009
Event	Materials Ireland Conference - Cork, Ireland Duration: 01 Dec 2009 → 01 Dec 2009

Conference	Materials Ireland Conference
Country/Territory	Ireland
City	Cork
Period	01/12/2009 → 01/12/2009

Cite this

@conference{810fa3bb87e2417087137b1146d0a048,

title = "The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding",

author = "Y.W. Low and Paul Rainey and Paul Baine and John Montgomery and David McNeill and Neil Mitchell and Harold Gamble and Mervyn Armstrong",

year = "2009",

month = dec,

language = "English",

pages = "0--0",

note = "Materials Ireland Conference ; Conference date: 01-12-2009 Through 01-12-2009",

}

TY - CONF

T1 - The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding

AU - Low, Y.W.

AU - Rainey, Paul

AU - Baine, Paul

AU - Montgomery, John

AU - McNeill, David

AU - Mitchell, Neil

AU - Gamble, Harold

AU - Armstrong, Mervyn

PY - 2009/12

Y1 - 2009/12

M3 - Paper

SP - 0

EP - 0

T2 - Materials Ireland Conference

Y2 - 1 December 2009 through 1 December 2009

ER -