The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding

Y.W. Low, Paul Rainey, Paul Baine, John Montgomery, David McNeill, Neil Mitchell, Harold Gamble, Mervyn Armstrong

Research output: Contribution to conferencePaper

LanguageEnglish
Pages0-0
Number of pages1
Publication statusPublished - Dec 2009
EventMaterials Ireland Conference - Cork, Ireland
Duration: 01 Dec 200901 Dec 2009

Conference

ConferenceMaterials Ireland Conference
CountryIreland
CityCork
Period01/12/200901/12/2009

Cite this

Low, Y. W., Rainey, P., Baine, P., Montgomery, J., McNeill, D., Mitchell, N., ... Armstrong, M. (2009). The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding. 0-0. Paper presented at Materials Ireland Conference, Cork, Ireland.
Low, Y.W. ; Rainey, Paul ; Baine, Paul ; Montgomery, John ; McNeill, David ; Mitchell, Neil ; Gamble, Harold ; Armstrong, Mervyn. / The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding. Paper presented at Materials Ireland Conference, Cork, Ireland.1 p.
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language = "English",
pages = "0--0",
note = "Materials Ireland Conference ; Conference date: 01-12-2009 Through 01-12-2009",

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Low, YW, Rainey, P, Baine, P, Montgomery, J, McNeill, D, Mitchell, N, Gamble, H & Armstrong, M 2009, 'The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding' Paper presented at Materials Ireland Conference, Cork, Ireland, 01/12/2009 - 01/12/2009, pp. 0-0.

The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding. / Low, Y.W.; Rainey, Paul; Baine, Paul; Montgomery, John; McNeill, David; Mitchell, Neil; Gamble, Harold; Armstrong, Mervyn.

2009. 0-0 Paper presented at Materials Ireland Conference, Cork, Ireland.

Research output: Contribution to conferencePaper

TY - CONF

T1 - The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding

AU - Low, Y.W.

AU - Rainey, Paul

AU - Baine, Paul

AU - Montgomery, John

AU - McNeill, David

AU - Mitchell, Neil

AU - Gamble, Harold

AU - Armstrong, Mervyn

PY - 2009/12

Y1 - 2009/12

M3 - Paper

SP - 0

EP - 0

ER -

Low YW, Rainey P, Baine P, Montgomery J, McNeill D, Mitchell N et al. The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding. 2009. Paper presented at Materials Ireland Conference, Cork, Ireland.