The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding

Y.W. Low, Paul Rainey, Paul Baine, John Montgomery, David McNeill, Neil Mitchell, Harold Gamble, Mervyn Armstrong

Research output: Contribution to conferencePaper

Original languageEnglish
Pages0-0
Number of pages1
Publication statusPublished - Dec 2009
EventMaterials Ireland Conference - Cork, Ireland
Duration: 01 Dec 200901 Dec 2009

Conference

ConferenceMaterials Ireland Conference
CountryIreland
CityCork
Period01/12/200901/12/2009

Cite this

Low, Y. W., Rainey, P., Baine, P., Montgomery, J., McNeill, D., Mitchell, N., Gamble, H., & Armstrong, M. (2009). The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding. 0-0. Paper presented at Materials Ireland Conference, Cork, Ireland.