The performance of printed circuit boards in the presence of production errors: a comparative analysis using various DEA models

Vincent Charles*, Mukesh Kumar, Irene Kavitha Charles

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

2 Citations (Scopus)

Abstract

The Printed Circuit Board (PCB) assembling production process is generally optimized to ensure very low levels of production errors (defects) so as to assure a higher quality product. In view of the number of components and solder joints in the products, and the very high demands placed on quality, the operation of this process is critical to the success of the products that are manufactured. A special class of the efficiency identification problem considered in this case relates to the occurrence of different kinds of production errors during the assembling process of the PCBs. However, the process of assembling often gets influenced by certain factors, which make some of the assembled PCBs to be defective. This chapter addresses the efficiency identification problem of a teleprinter-manufacturing company that assembles PCBs. The technique of Data Envelopment Analysis (DEA) is used to assess the efficiency of different types of PCBs.

Original languageEnglish
Title of host publicationHandbook of research on strategic performance management and measurement using data envelopment analysis
EditorsIbrahim H. Osman, Abdel Latef Anouze, Ali Emrouznejad
PublisherIGI Global
Pages487-509
Number of pages23
ISBN (Electronic)9781466644755
ISBN (Print)9781466644748
DOIs
Publication statusPublished - 30 Nov 2014
Externally publishedYes

ASJC Scopus subject areas

  • Economics, Econometrics and Finance(all)
  • General Business,Management and Accounting

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