Thermal Vias for SOI Technology

Paul Baine, S. Uppal, Michael Bain, Mervyn Armstrong, Neil Mitchell, Harold Gamble

Research output: Contribution to conference › Paper

Original language	English
Pages	239-242
Number of pages	4
Publication status	Published - Oct 2000
Event	International Conf. on Communications, Computers & Devices - Kharagpur, India Duration: 01 Nov 2000 → …

Conference	International Conf. on Communications, Computers & Devices
Country	India
City	Kharagpur
Period	01/11/2000 → …

Cite this

@conference{34e250ba0d984e2889b0ccfd03e85135,

title = "Thermal Vias for SOI Technology",

author = "Paul Baine and S. Uppal and Michael Bain and Mervyn Armstrong and Neil Mitchell and Harold Gamble",

year = "2000",

month = oct,

language = "English",

pages = "239--242",

note = "International Conf. on Communications, Computers & Devices ; Conference date: 01-11-2000",

}