Thermal Vias for SOI Technology

Paul Baine, S. Uppal, Michael Bain, Mervyn Armstrong, Neil Mitchell, Harold Gamble

Research output: Contribution to conferencePaper

Original languageEnglish
Number of pages4
Publication statusPublished - Oct 2000
EventInternational Conf. on Communications, Computers & Devices - Kharagpur, India
Duration: 01 Nov 2000 → …


ConferenceInternational Conf. on Communications, Computers & Devices
Period01/11/2000 → …

Cite this

Baine, P., Uppal, S., Bain, M., Armstrong, M., Mitchell, N., & Gamble, H. (2000). Thermal Vias for SOI Technology. 239-242. Paper presented at International Conf. on Communications, Computers & Devices, Kharagpur, India.