Thermal Vias for SOI Technology

Paul Baine, S. Uppal, Michael Bain, Mervyn Armstrong, Neil Mitchell, Harold Gamble

Research output: Contribution to conferencePaper

Original languageEnglish
Pages239-242
Number of pages4
Publication statusPublished - Oct 2000
EventInternational Conf. on Communications, Computers & Devices - Kharagpur, India
Duration: 01 Nov 2000 → …

Conference

ConferenceInternational Conf. on Communications, Computers & Devices
CountryIndia
CityKharagpur
Period01/11/2000 → …

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