A strategy for the simulation of the whole thermoforming process, from the infrared heating to the stamping, is presented here. Two loosely coupled simulation tools are being developed: the first one computes a realistic 3D, transient temperature field of the composite stack inside an infrared oven, considering the radiative, conductive and convective heat transfers; the temperature distribution is used as an input for the second that aims at simulating the thermomechanical behaviour of the composite during the forming step via a non-orthogonal constitutive model. The steps for the identification of the model parameters are introduced. Initial validation tests show realistic results in term of shear angle distribution.
|Name||AIP Conference Proceedings|