A strategy for the simulation of the whole thermoforming process, from the infrared heating to the stamping, is presented here. Two loosely coupled simulation tools are being developed: the first one computes a realistic 3D, transient temperature field of the composite stack inside an infrared oven, considering the radiative, conductive and convective heat transfers; the temperature distribution is used as an input for the second that aims at simulating the thermomechanical behaviour of the composite during the forming step via a non-orthogonal constitutive model. The steps for the identification of the model parameters are introduced. Initial validation tests show realistic results in term of shear angle distribution.
|Title of host publication||Proceedings of the 20th International ESAFORM Conference on Material Forming, ESAFORM 2017|
|Publisher||American Institute of Physics|
|Publication status||Published - 01 Oct 2017|
|Name||AIP Conference Proceedings|
Baumard, T., Menary, G., de Almeida, O., Schmidt, F., Martin, P., & Bikard, J. (2017). Towards a coupled heating-forming simulation of the thermoforming of thermoplastic composites. In Proceedings of the 20th International ESAFORM Conference on Material Forming, ESAFORM 2017 (Vol. 1896).  (AIP Conference Proceedings). American Institute of Physics. https://doi.org/10.1063/1.5008022