Using glyoxylic acid as a substitute for formaldehyde in electroless copper plating

X. Wu, Wei Sha

    Research output: Non-textual formExhibition

    Original languageEnglish
    Place of PublicationPoster Competition
    PublisherUnknown Publisher
    Publication statusPublished - Mar 2007

    Bibliographical note

    Commissioning Body / Publisher: Queen’s University Belfast

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