Variable frequency microwave curing of polymer materials in microelectronics packaging applications

T. Tilford, K.L. Sinclair, George Goussetis, C. Bailey, M.P.Y. Desmulliez, A.K. Parrott, A.J. Sangster

Research output: Contribution to conference › Paper

Original language	English
Pages	791-796
Number of pages	6
Publication status	Published - Dec 2007
Event	9th Electronics Packaging Technology Conference - Singapore, Singapore Duration: 01 Dec 2007 → 01 Dec 2007

Conference	9th Electronics Packaging Technology Conference
Country/Territory	Singapore
City	Singapore
Period	01/12/2007 → 01/12/2007

Cite this

@conference{6b10029b27bd47d2a183e62d6b1aff37,

title = "Variable frequency microwave curing of polymer materials in microelectronics packaging applications",

author = "T. Tilford and K.L. Sinclair and George Goussetis and C. Bailey and M.P.Y. Desmulliez and A.K. Parrott and A.J. Sangster",

year = "2007",

month = dec,

language = "English",

pages = "791--796",

note = "9th Electronics Packaging Technology Conference ; Conference date: 01-12-2007 Through 01-12-2007",

}

TY - CONF

T1 - Variable frequency microwave curing of polymer materials in microelectronics packaging applications

AU - Tilford, T.

AU - Sinclair, K.L.

AU - Goussetis, George

AU - Bailey, C.

AU - Desmulliez, M.P.Y.

AU - Parrott, A.K.

AU - Sangster, A.J.

PY - 2007/12

Y1 - 2007/12

UR - http://www.scopus.com/inward/record.url?scp=50049118320&partnerID=8YFLogxK

M3 - Paper

SP - 791

EP - 796

T2 - 9th Electronics Packaging Technology Conference

Y2 - 1 December 2007 through 1 December 2007

ER -