Variable frequency microwave curing of polymer materials in microelectronics packaging applications

T. Tilford, K.L. Sinclair, George Goussetis, C. Bailey, M.P.Y. Desmulliez, A.K. Parrott, A.J. Sangster

Research output: Contribution to conferencePaper

1 Citation (Scopus)
Original languageEnglish
Pages791-796
Number of pages6
Publication statusPublished - Dec 2007
Event9th Electronics Packaging Technology Conference - Singapore, Singapore
Duration: 01 Dec 200701 Dec 2007

Conference

Conference9th Electronics Packaging Technology Conference
CountrySingapore
CitySingapore
Period01/12/200701/12/2007

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