Atmospheric-pressure plasma activation for low temperature bonding

    Research output: Contribution to conferencePaper

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    Original languageEnglish
    Pages0-0
    Number of pages1
    Publication statusPublished - Oct 2010
    Event218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications - Las Vegas, United States
    Duration: 01 Oct 201001 Oct 2010

    Conference

    Conference218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications
    CountryUnited States
    CityLas Vegas
    Period01/10/201001/10/2010

    ID: 733982