Effects of copper grain structure on electromigration behaviour

    Research output: Contribution to conferencePaper

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    Original languageEnglish
    Pages39-42
    Number of pages4
    Publication statusPublished - Sep 2001
    EventProceedings of 9th International Symposium on Integrated Circuits, Devices & Systems - Singapore, Singapore
    Duration: 01 Sep 200101 Sep 2001

    Conference

    ConferenceProceedings of 9th International Symposium on Integrated Circuits, Devices & Systems
    CountrySingapore
    CitySingapore
    Period01/09/200101/09/2001

    ID: 726854