Low Temperature Bonding of PECVD Silicon Dioxide Layers

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    Original languageEnglish
    Number of pages9
    Pages (from-to)165-173
    JournalECS Transactions
    Journal publication dateNov 2006
    Issue number6
    Publication statusPublished - Nov 2006
    Event210th Electrochemical Society Meeting, Semiconductor Wafer Bonding : Science, Technology and Application - Cancun, Mexico
    Duration: 01 Nov 200601 Nov 2006

    ID: 49740809