Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

    Research output: Contribution to conferencePaper

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    Original languageEnglish
    Publication statusPublished - Apr 2003
    Event7th International Symposium on Semiconductor Wafer Bonding - Paris, France
    Duration: 01 Apr 200301 Apr 2003

    Conference

    Conference7th International Symposium on Semiconductor Wafer Bonding
    CountryFrance
    CityParis
    Period01/04/200301/04/2003

    ID: 607602