Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing

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    Original languageEnglish
    Number of pages6
    Pages (from-to)307-312
    JournalJournal of Materials Science: Materials in Electronics
    Journal publication dateJun 2001
    Issue number4-6
    Volume12(4-6)
    Publication statusPublished - Jun 2001

    ID: 724929